TSMC concedes Intel's EMIB is potent, starts building quasi-EMIB packaging
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TSMC has started building an internal project called 'quasi-EMIB' that clones elements of Intel's EMIB advanced packaging technology. The move comes as Intel's EMIB attracts growing orders and TSMC's own CoWoS capacity remains choked through 2026.
The EMIB Advantage
Intel's Embedded Multi-die Interconnect Bridge (EMIB) connects chiplets using tiny silicon bridges embedded directly into the organic substrate, with high-density micro-bumps placed only at chiplet edges. Unlike TSMC's CoWoS-L, EMIB requires no separate redistribution layer (RDL) or silicon interposer, eliminating an entire assembly step. Intel's next-gen EMIB-T will add through-silicon vias (TSVs) drilled through the bridges for even greater density. This leaner architecture has made EMIB a potent challenger to TSMC's packaging dominance.
CoWoS Capacity Crunch
TSMC's CoWoS advanced packaging remains severely constrained through 2026, with its CoWoS-S variant relying on costly full-surface silicon interposers. The newer CoWoS-L reduces expense by replacing the interposer with an RDL substrate and local silicon interconnects (LSIs), but it still demands two separate assembly and attachment steps. These inefficiencies, combined with egregious capacity limitations, have pushed some customers toward Intel's EMIB.
TSMC's Quasi-EMIB Response
The Taiwanese chipmaker's internal quasi-EMIB project aims to replicate Intel's approach by embedding bridges directly into the substrate, according to The Information. The design borrows heavily from EMIB's single-step attachment method, potentially reducing complexity and cost. TSMC has not disclosed a timeline, but the move signals a rare concession to Intel's competitive packaging methodology.
What's Next
TSMC is expected to finalize quasi-EMIB design parameters by next year, though production readiness remains uncertain. It remains unclear whether the clone can match the performance of Intel's upcoming EMIB-T, which may further intensify the packaging battle.
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TSMC concedes Intel's EMIB is potent, starts building quasi-EMIB packaging
