Xiaomi unveils Xring O3 chip, partners with TSMC for 3nm production
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Xiaomi on Monday unveiled its new Xring O3 smartphone processor, manufactured by TSMC using 3-nanometre technology, according to two sources. The chip is expected to power Xiaomi's upcoming flagship folding phone, with a shipment target of 200,000 to 300,000 units. The move deepens Xiaomi's push into in-house chips, challenging Huawei's 68% share of China's foldable phone market.
Key Facts
- Xiaomi unveiled the Xring O3, its second proprietary smartphone processor, on August 24, 2026.
- TSMC will manufacture the Xring O3 using its 3-nanometre production technology, according to two sources.
- The Xring O3 is expected to power Xiaomi's upcoming flagship folding phone, with a shipment target of 200,000 to 300,000 units.
- Huawei held a 68% share of China's foldable phone market in Q2 2026, shipping 1.6 million units, according to Smart Analytics Global.
- Cumulative shipments of devices powered by the Xring O1 surpassed 1 million units since its launch, Xiaomi said during an earnings call last week.
Chip Specifications
The Xring O3 is built on TSMC's 3-nanometre process, according to two people familiar with the matter. The chipset includes CPU and GPU upgrades and mobile-first support for LPDDR6 RAM. Xiaomi's first proprietary processor, the Xring O1, launched in May 2025 and has powered about 150,000 smartphones since then, according to the sources.
Market Context
Xiaomi is the world's third-largest smartphone vendor and is expanding into foldable phones, a premium segment dominated by Huawei. Huawei shipped 1.6 million foldable phones in China in the second quarter, giving it a 68% market share, followed by Honor with 13.7% and Oppo with 8.5%, according to Smart Analytics Global. Xiaomi sold 65 million handsets in the first half of 2026 at an average price of 1,329 yuan ($197). Device makers are pushing for in-house chips to differentiate products and reduce dependence on suppliers such as Qualcomm and MediaTek.
2 sources
Xiaomi unveils Xring O3 chip, partners with TSMC for 3nm production



