TSMC, Qualcomm and ASML: AI chips accelerate contracts and lithography
Three events in the semiconductor market are united by one storyline — expanding capacity and partnerships to meet demand for AI chips. TSMC reported a 53.3% increase in August revenue, Qualcomm agreed with Amazon on custom chips for data centers, and ASML secured commitments from TSMC and Samsung to adopt High NA EUV. The reports were published September 8–10, 2026.
Sources
· 9Выручка TSMC в августе выросла на 53,3% до NT$514,8 млрд на спросе на ИИ-чипы
1Qualcomm подписал соглашение о поставке Amazon кастомных ИИ-чипов
2ASML заручилась согласием TSMC и Samsung на внедрение High NA EUV к 2028 году
3Waymo создала собственный чип для роботакси производительностью более 1000 TOPS
4Marvell предоставила Google опцион на покупку акций на сумму до $12,2 млрд в рамках сделки по чипам
5Спрос на ИИ поддержал промпроизводство Азии в августе
6Xiaomi представила чип Xring O3 и договорилась с TSMC о производстве по 3-нм техпроцессу
7Nvidia инвестирует $3,5 млрд в конвертируемые облигации MediaTek
8TSMC Revenue Rises 53% as AI Chip Demand Outstrips Supply
9Key points
- TSMC's August revenue rose 53.3% year over year to NT$514.8 billion ($16.3 billion).
- Qualcomm and Amazon announced a collaboration to supply several generations of custom AI chips for AWS; Amazon received a warrant for 25 million Qualcomm shares at $161.26.
- ASML received commitments from Samsung and TSMC to adopt High NA EUV in mass production by 2028 and from 2030, respectively.
- Intel is already using High NA EUV machines, which can cost up to $400 million.
- Analysts on average expect TSMC sales to grow 46.8% in the current quarter.
What happened
Taiwan Semiconductor Manufacturing Co.'s August revenue was NT$514.8 billion ($16.3 billion), up 53.3% from a year earlier. The company, the main manufacturer of chips for Nvidia and Apple, said it cannot keep up with demand from global AI infrastructure construction, despite an unprecedented pace of building new plants.
ASML Holding NV received commitments from Samsung Electronics and TSMC to introduce High NA EUV equipment into mass production by 2028 and from 2030, respectively. The companies also agreed to move from 6-inch to 12-inch photomasks to improve productivity and reduce costs. Intel is already using these machines, which can cost as much as $400 million.
What changed
Similar structured deals were already in the mimile.kz archive: Marvell granted Google a stock option worth up to $12.2 billion, and Nvidia invested $3.5 billion in MediaTek convertible bonds.
Who's affected
TSMC, Qualcomm, Amazon, Samsung, ASML and Intel are directly affected: TSMC supplies chips to Nvidia and Apple, Qualcomm has struck a deal with Amazon, and Samsung and Intel are involved in deploying ASML equipment.
What to watch
Samsung Electronics plans to start using ASML's High NA EUV equipment for mass production by 2028, while TSMC will start from 2030.
Earlier
- Waymo created its own ASIC chip for robotaxis using TSMC's 5nm process, delivering more than 1000 TOPS.
- Xiaomi introduced the Xring O3 chip and agreed with TSMC on production using the 3nm process.
- AI demand supported Asian industrial production in August: China's PMI rose to 51.5, Japan's to 54.9, and South Korea's to 52.3.
What's Next
Samsung Electronics will begin using High NA EUV in mass production by 2028, while TSMC will start from 2030.
Related original articles
- 7h agoВыручка TSMC в августе выросла на 53,3% до NT$514,8 млрд на спросе на ИИ-чипыYahoo Finance
- 1d agoQualcomm подписал соглашение о поставке Amazon кастомных ИИ-чиповYahoo Finance
- 2d agoASML заручилась согласием TSMC и Samsung на внедрение High NA EUV к 2028 годуYahoo Finance