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TSMC, Qualcomm and ASML: AI chips accelerate contracts and lithography
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ASML secures TSMC, Samsung adoption of High NA EUV machines by 2028

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ASML secures TSMC, Samsung adoption of High NA EUV machines by 2028

This digest was compiled by AI from multiple sources — links to the originals are below.

ASML Holding NV has won commitments from Samsung Electronics and TSMC to adopt its High NA EUV lithography equipment for high-volume manufacturing by 2028 and from 2030 respectively. The companies also agreed to shift from 6-inch to 12-inch photomasks, aiming to boost productivity and cut costs. Intel already uses the machines, which can cost $400 million each.

Key Facts

  • Samsung Electronics plans to adopt ASML's High NA EUV lithography equipment for high-volume manufacturing by 2028.
  • TSMC plans to adopt the same High NA EUV equipment from 2030.
  • The four companies—ASML, Intel, Samsung, and TSMC—agreed to move from 6-inch to 12-inch photomasks.
  • ASML's High NA EUV machines can cost $400 million each.
  • The new technology could increase throughput from High NA machines by 40%, according to ASML CTO Marco Pieters.

High NA EUV Adoption

Samsung Electronics and Taiwan Semiconductor Manufacturing Co. plan to begin using ASML's High NA EUV lithography equipment for high-volume manufacturing by 2028 and from 2030 respectively. Intel Corp. already uses the machines, which can cost $400 million each. Samsung is the leading maker of memory chips, while TSMC is the leader in producing custom chips for companies like Nvidia Corp. and Apple Inc. ASML is the only company in the world that can make extreme ultraviolet lithography equipment, necessary for manufacturing the most advanced AI accelerators.

Photomask Format Shift

The four companies agreed to shift from the current 6-inch photomasks to 12-inch versions, aiming to boost productivity and reduce costs. The new technology could increase throughput from High NA machines by 40% while simplifying the design process, said Marco Pieters, chief technology officer at ASML. Pieters called the shift a huge opportunity and a significant step in productivity.

Industry Context

ASML debuted low NA EUV in 2019 and has been working with customers to adopt the more sophisticated High NA machines. TSMC, whose factories handle production for customers from Nvidia and Advanced Micro Devices Inc. to Qualcomm Inc., has been deliberately cautious in adopting the more expensive machinery, arguing the cost wasn't yet justified by the productivity gains.

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